Canteliver Probe Card
MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Exhibit driver, logic, and memory machine. MPI’s cantilever probes tend to be the corresponding solution on the requires of fine pitch, compact pad dimension, large pace, less cleaning, multi-DUT, higher pin count, and ultra-minimal leakage necessities. With superb craftsmanship, revolutionary architecture and verified methodologies determined by mechanical and electrical simulation/measurement effects, earning MPI the best cantilever service provider worldwide.
FCB Probe Card
The FCB Probe Card is the most experienced technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) demand from customers. FCB is often a demonstrated Option for various semiconductor creation exams from early engineering pilot-runs to superior quantity manufacturing (HVM). FCB is prepared for product necessitating large signal integrity probing (SI) and/or electric power integrity probing (PI). Apps contain cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB ensures the entire world’s very best In general Charge-of-ownership (COO) for various DUT apps.
EVS Probe Card
The EVS Probe Card is surely an improvement about the conventional buckling beam probe card. Vital characteristics are greater present-day carrying capability (C.C.C.) and lower well balanced Get in touch with pressure (BCF), in addition to In general MEMS-like qualities. EVS can certainly meet the necessity of advanced wafer probing. Exact alignment and fantastic planarity Handle are the essential things contributing to stable Get hold of resistance. With its capacity and effectiveness, EVS Probe Card is a perfect choice for Highly developed probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand from customers for ever finer pitch. It really is created for smaller Al pad, and it is ideal for little pitch software with peripheral and full array pattern. With precise alignment and greater planarity Command, Osprey can attain larger productiveness by multi-DUT structure. The forming wire (FW) type needle made with MPI’s possess micro fabrication course of action don't just provides higher-top quality effectiveness but will also allows easy needle replacement and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of reduced force probing. Additionally, it comes with the ability to fulfill significant C.C.C. and significant pin counts software. The MEMS approach assures very constant needle EVS Probe Card traits, and also the special composition structure permits exact alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/